12-12 vol. 1 sales offices: visit our web site at http://www.temex.com how to order? dh80053 - 06 t3 diode type package conditioning information -06: smd4 t1: 1000 pieces -40: smd4am tape & reel smd8am t3: 3000 pieces -20: sdm6 tape & reel -24: smd8 blank: bulk silicon pin diodes square ceramic surface mountable pin diodes square ceramic surface mountable pin diodes description these pin diodes are manufactured in a square package (smd) for surface mount applications. these packages utilize ceramic package technology with low inductance and axial terminations. this design simpli?s automatic pick and place indexing and assembly. the termination contacts are tin lead plated for vapor or re?w circuit board soldering on printed circuit boards. these diodes are particularly suited for applications in frequency hopping radios, low loss, low distortion, and ?ters in hf, vhf and uhf frequencies. packages packages smd4 smd4am smd6 smd8 smd8am dh50209 -06 -40 dh80050 -06 -40 dh80051 -06 -40 dh80052 -06 -40 dh80053 -06 -40 dh80054 -06 -40 dh80055 -06 -40 -20 dh80082 -06 -40 -20 dh80100 -06 -40 -20 dh80102 -20 -24 -44 dh80106 -24 -44 other speci?ations available on request.
12-13 vol. 1 silicon pin diodes square ceramic surface mountable pin diodes sales offices: visit our web site at http://www.temex.com electrical characteristics low voltage pin diodes breakdown total forward minority v br capacitance series resistance carrier (v) ct (pf) r sf ( ? ) t l (?) test ir = 10 ? vr = 50 v if = 50 ma if = 10 ma conditions f = 1 mhz f = 120 mhz ir = 6 ma type min. typ. max. max. min. dh50209 200 1.00 1.20 0.25 2.00 medium voltage pin diodes applicable breakdown total capacitance forward series minority max. power voltage v vbr ct resistance rsf carrier dissipation (v) (v) (pf) ( ? ) l (?) 25 c test i < 10 a ir = 10 a vr = 50 v i= 100ma i= 200 ma if= 10ma contact free conditions f = 1mhz f= 120mhz f= 120 mhz ir= 6ma surface air type max. typ. typ. max. max. min. w (1) w (2) dh80050 500 550 0.40 0.45 0.70 0.65 1.1 3.0 1.2 dh80051 500 550 0.55 0.65 0.60 0.55 1.5 3.5 1.2 dh80052 500 550 0.85 1.05 0.40 0.35 2.0 4.0 1.2 dh80053 500 550 1.05 1.20 0.35 0.30 2.5 4.0 1.5 dh80054 500 550 1.25 1.35 0.30 0.27 3.0 4.5 1.5 dh80055 500 550 1.45 1.55 0.28 0.25 3.5 4.5 1.5 (1) diode brazed on in?ite copper heat sink (2) diode brazed on epoxy circuit (pcb)
12-14 vol. 1 sales offices: visit our web site at http://www.temex.com silicon pin diodes square ceramic surface mountable pin diodes medium voltage pin diodes applicable breakdown total capacitance forward series minority max. power voltage v vbr ct resistance rsf carrier dissipation (v) (v) (pf) ( ? ) l (?) 25 c test i < 10 a ir = 10 a vr = 50 v i=100ma i=200 ma if=10ma contact free conditions f = 1mhz f=120mhz f=120 mhz ir=6ma surface air type max. typ. typ. max. max. min. w (1) w (2) dh80082 800 850 0.90 1.00 0.40 0.35 3.00 tbd tbd dh80100 1000 1100 0.55 0.65 0.70 0.60 3.00 tbd tbd dh80102 1000 1100 0.85 1.00 0.50 0.35 4.00 tbd tbd dh80106 1000 1100 1.25 2.00 0.35 0.30 7.00 tbd tbd (1) diode brazed on in?ite copper heat sink (2) diode brazed on epoxy circuit (pcb) temperature ranges operating junction (t j ) : -55 c to +150 c storage : -65 c to +150 c series resistance vs. forward current 0.1 10 100 1000 i (ma) 1 10 100 r sf ( ? ) 0 dh80052 dh80050 0.1 10 100 1000 i (ma) 0 1 10 100 r sf ( ? ) dh80053 dh80051
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